Focuz

Focuz has extensive experience in packaging of hybrid electronic and laser for various applications: optical telecom & datacom, biomedical & healthcare, advanced consumer electronic, and industrial & metrology. The package types range from TO-Can to Box-type or Butterfly package.

Our key process capabilities are:

Die Attachment

• Eutectic with wide range of solder alloys
  
• Thermocompression, thermosonic, and ultrasonic processes
  
• Adhesive & UV curing
• Better than 1 um post-bonding accuracy
• Die shear test per MIL-STD-883
  

Wire Bonding

• Ball bond and stud bump with gold and copper wires
• Wedge bond with gold and aluminum wires
• Ribbon bond
  
• Wire pull test per MIL-STD-883

Optics Alignment & Attachment

• Submicron precision alignment
• Active/Passive
• Automated/semi-auto/manual
• Attachment processes include
• Laser welding
• Laser soldering
• Glass Soldering
  
• Soldering
• Adhesives
• Mechanical fastening
  

Hermetic Sealing

• Sealing processes include
• Projection welding
• Resistance seam welding
• Laser welding
  
• Glass sealing
• Soldering
  
• Leak test per MIL-STD-883E

Burn-In & Functional Testing

• Optical/Electrical, Digital/Analog
• Test parameters are BERs, Eye diagram, IL, BR, spectrum, wavelength, ER, etc.
  

Others

• Wafer dicing
• Plasma cleaning